PCB laser drilling machine (semiconductor package substrates, CF laser).The GTF6 series is Mitsubishi Electric’s new CF-laser drilling machine, delivering high-speed, high-precision and stable hole drilling for semiconductor package substrates.
Next-generation substrate drilling
- New model dedicated to drilling semiconductor package substrates
- High-speed, high-precision and stable hole drilling
- Shown as a live machine at JPCA Show 2026 (exhibited model ML605GTF6-5500UXM)
