PCB laser drilling machine (semiconductor package substrates, UV).The GTF5-UVP series carries a UV laser for increasingly fine semiconductor package substrates, drilling φ10 µm-class micro vias at high speed with high precision and stability.
Micro-via drilling
- High-speed, high-precision and stable drilling of φ10 µm-class vias
- Designed for ever-finer semiconductor package substrates
- New model first shown as a live machine at JPCA Show 2024 (UV variant of the GTF5 platform)
